Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Publisher:
International Electrotechnical Commission - Technical Report

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

Edition :	1.0
File Size :	1 file , 2.6 MB
ISBN(s) :	9782832210623
Note :	This product is unavailable in Russia, Belarus, Ukraine, Canada
Number of Pages :	24
Published :	12/01/2021

IEC/TR 63378-1 Ed. 1.0 en:2021 PDF

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

History

Related products

Best-Selling Products